Application Note AN - 9056 Using Fairchild Semiconductor Dual Cool TM MOSFETs

INTRODUCTION Pursuing a strategy of power density leadership, Fairchild Semiconductor has released a new power specific packaging technology, Dual Cool TM , to meet the rigors of escalating demand for more improved thermal management in electronics designs. This technology creates a direct heat path from both the drain and source sides of the vertical MOSFET die structure through the addition of a heat slug to the top of the package. This structure allows for supplemental cooling on the top of the package with a heat sink system in addition to the direct conduction path in to the printed circuit board.